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S71WS-NX0 - Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP

S71WS-NX0_735583.PDF Datasheet
 
Part No. S71WS-NX0 S71WS512ND0BFWA23 S71WS512NC0BFWA23 S71WS512NC0BAWY62 S71WS512NC0BAWY32 S71WS512NC0BAWY30 S71WS512NC0BAWY33 S71WS512NC0BFWY30 S71WS512ND0BFWA33 S71WS512NC0BAWA33 S71WS512ND0BFWE30 S71WS512NC0BFWE32 S71WS512ND0BAWY32
Description Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
File Size 2,302.47K  /  188 Page  

Maker
Spansion Inc.
Spansion, Inc.
SPANSION LLC

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S71WS-NX0 S71WS512ND0BFWA23 S71WS512NC0BFWA23 S71W Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
 Spansion Inc.
Spansion, Inc.
SPANSION LLC
S70WS512N00BFWA23 S70WS512N00BAWAB3 S70WS512N00BAW Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory 同硅晶片堆叠多芯片产品（MCP）的512兆位2兆16位）的CMOS 1.8伏，只有同时写，突发模式闪存
 Spansion Inc.
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